Full-Stack Execution
Where materials meet intelligence, and vision becomes hardware.
Over the last decade, I’ve built and scaled products that push the boundaries of what’s possible in sustainable hardware — from carbon-fiber smartphones to edge-AI powered devices and globally certified consumer electronics.
My approach blends engineering depth with business acumen, guiding multidisciplinary teams through the full journey: from raw materials and embedded design, to manufacturing scale-up and post-launch intelligence.
Below is a breakdown of the core domains I operate in — each one a layer in the stack of world-class product execution.
1. System Architecture & Manufacturing
I specialize in defining system architectures that are not only high-performance and user-centric, but also manufacturable and scalable. Whether it’s modular smartphones or embedded devices, my work balances design ambition with production reality.
Experience includes:
Electrical & mechanical co-design
Modular architecture for upgradeability and circularity
Tooling, FEA, and DFM/DFA reviews
Vertically integrated manufacturing setups (Europe, Asia, MENA)Supply chain resilience and second-sourcing strategies
2. Embedded Intelligence & OTA-Enabled Devices
At Carbon Mobile and beyond, I led teams embedding intelligence directly at the edge. These devices didn’t just ship — they evolved. I built infrastructure and processes to ensure products stayed up-to-date, secure, and responsive to user needs.
Capabilities include:
Embedded system design (from drivers to cloud sync) OTA infrastructure and version upgrade pipelines
Open-source and proprietary stack integration
AI-at-the-edge deployment across sensors, motion, and materials
3. Material Innovation & Advanced Composites
Innovation doesn’t stop at design — it starts with materials. I developed and patented HyRECM Technology, a carbon fiber-based technology that disrupted the status quo in consumer electronics. My work bridges material science with product application.
Highlights:
Sustainable material sourcing (low-impact, recyclable)
Integration of novel composites into electronics
Strategic partnerships with global OEMs (e.g., Qualcomm, Logitech)
4. Certification, Compliance & Lifecycle Engineering
Shipping products globally means mastering the invisible layers — certifications, lifecycle durability, and regulatory compliance. I’ve led engineering teams through complex certification processes and ensured robust lifecycle support.
Core competencies:
CE, FCC, REACH/ROHS, and MNO certification pipelines
Environmental/social labels (e.g., Blue Angel)
Lifecycle testing (ALT, HALT, signal integrity, thermal, RF)
Failure analysis, ECN process, and reverse logistics design
5. Full-Stack Product Development
True innovation lives across layers. I’ve owned programs that span the entire stack — not just integrating functions, but deeply understanding them. From chip to cloud, from design to field support, I’ve delivered products that work and scale.
Expertise across:
Hardware: Baseband, RF, power, antennas, sensors
Mechanical: Housing, thermal, vibration, ingress, CMF
Software: Kernel to cloud stack, OTA delivery, device intelligence
Quality: Validation, testing, failure tracking
NPI: EVT/DVT/PVT through mass production
5. Full-Stack Product Development
True innovation lives across layers. I’ve owned programs that span the entire stack — not just integrating functions, but deeply understanding them. From chip to cloud, from design to field support, I’ve delivered products that work and scale.
Expertise across:
Hardware: Baseband, RF, power, antennas, sensors
Mechanical: Housing, thermal, vibration, ingress, CMF
Software: Kernel to cloud stack, OTA delivery, device intelligence
Quality: Validation, testing, failure tracking
NPI: EVT/DVT/PVT through mass production
6. Strategic Sourcing & Manufacturing Scale-Up
I’ve shipped products in high-pressure environments — limited budgets, evolving specs, and aggressive timelines. I specialize in supply chain architecture, factory readiness, and second-sourcing strategies that make execution repeatable.
Work includes:
Component selection and lifecycle risk planning
Negotiation and structuring of supplier agreements
EOL planning and product redesign
Line balancing, jig/fixture planning, factory setup
Vendor management across Europe, Asia, and the Gulf
7. Toolchain & Infrastructure Enablement
Behind every successful product is a robust internal ecosystem. I’ve built the tools and workflows that enable lean teams to operate like large organizations — from diagnostics to CI pipelines to traceability and servicing.
Systems I’ve developed:
Design & simulation environments
Custom internal tools for BOM, testing, and traceability
CI/CD infrastructure for firmware updates
Serialization and diagnostics for service networks
Dev tools for open-source and internal teams
8. Leadership in Complex Hardware Programs
Execution isn’t just engineering — it’s orchestration. I’ve led globally distributed teams that delivered first-of-their-kind hardware programs, navigating through ambiguity, crisis, and breakthrough.
Leadership track record:
Program leadership from concept to mass production
Team structuring, hiring, mentorship
Cross-border stakeholder alignment (OEMs, CMs, investors)
Crisis management (e.g., supplier shutdowns, pivots)
Translating deep tech into business outcomes
